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Beijing COMPO Advanced Technology Co., Ltd. established in 2005, a subsidiary company of Beijing General Research Institute for Non-ferrous Metals (GRINM) , is a high-tech enterprise which specialized in R&D, production, trade and service for Tin-based solders and Non-ferrous new materials.

 

    COMPO is supported by the National Engineering Research Center for Non-ferrous Metal Composites, which is a department of GRINM, owns specialists and experienced technicians who are engaged in advanced materials, novel process and new technology.

 

    Located in Yanqi lake Economic Development Area of Huairou, COMPO has factories for high quality tin-based solder and novel electronic materials, including solder powder, solder wire, solder bar, BGA solder ball, anti-oxidant alloy and packaging materials, with the total capacity 2000 tons per year. The company has been certificated by ISO9001 and ISO14001 Management System.

 
 
Copyright@ Beijing Compo Advanced Technology Co.,Ltd. Tel:010-82241219 82241218 Fax:010-62366747
ADD:North Third Ring Road, Haidian District, Beijing, No. 43 Zip:100088
E-mail:composolder@163.com market@composolder.com 京ICP备06003955号