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| 1.Fine solder wire |
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| With the small volume, full-featured, high intelligence semiconductor products appearance, the packaging towards to narrow pitch, high-density and integrated, which make higher demands on the solder wire. Solder wire is one of the key materials to achieve integrated circuits or circuit board components.Recently, LSI(Large-scale integration circuit) turns more integrated,and their assembly and repair need more and more fine solder wire, especially for the Sn-Bi system wire,which is difficult to obtain because of the brittleness. |
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2.Fusible (low-melting alloy) |
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| Fusible is widely used as a solder or thermal fuses and other components (such as fire damper, exhaust vent, exhaust fans, fusible sprinkler nozzle, concealed automatic sprinklers, fire doors, fire rolling and generating transformers, temperature control valve, alarms, home appliances ,temperature-sensitivesafety device and other heat-sensitive components), and also widely used in medicine (such as the block for radiation therapy). So it is a class of potential favorable low melting point alloy. |
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| 3.Superfine oxygen spherical solder powder (Extremely fine low oxygen solder powder) |
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| Ultra-fine spherical solder powder can be used for high quality printing and preparation of solder bumps. |
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