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The company relied on Beijing General Research Institute For Non-ferrous Metals, With over 10 years of experience in metal granulation. Beijing Compo Advanced Technology Co., Ltd. was established on its basis, restructuring, with R & D capability through continuous research and development efforts, now achieves the patents more than a dozen of product ,shares most of domestic market ,the company now owns different alloy products series more than ten categories, specification model, particle size distribution of an all-encompassing.
Alloy composition is classified according to different series of products for customers inquiry.
 
1. Solder powder
 
2. Anti-oxidant alloy
 
3. Solder wire series
 
4.Solder Spheres --BGA (Ball Grid Array)
 
5. SiCp / Al composites
 
 
Copyright@ Beijing Compo Advanced Technology Co.,Ltd. Tel:010-82241219 82241218 Fax:010-62366747
ADD:North Third Ring Road, Haidian District, Beijing, No. 43 Zip:100088
E-mail:composolder@163.com market@composolder.com 京ICP备06003955号