北京康普锡威科技有限公司BGA/CSP

BGA/CSP solder ball

BGA/CSP is the key material to enable electronic products becoming miniature, highly reliable, electromagnetic compatible and more safe, thus making it widely used in semiconductor packaging.

    Sn63Pb37
        Sn60Pb40
       Sn62Pb36Ag2

          Sn95.5Ag4.0Cu0.5
              Sn96.5Ag3.0Cu0.5X
              Sn95.5Ag3.8Cu0.7X
              Sn98.5Ag1.0Cu0.5
              Sn96.5Ag3.5

       Sn5Pb95
           Sn10Pb90
           Sn2.5Pb95Ag2.5
           Sn10Pb88Ag2
           Sn95sb5

１	0.76	±0.010	≤3%	＞1.66
２	0.65	±0.010	≤3%	＞1.66
３	0.60	±0.010	≤3%	＞1.66
４	0.55	±0.010	≤3%	＞1.66
５	0.5	±0.008	≤3%	＞1.66
６	0.45	±0.008	≤3%	＞1.66
７	0.40	±0.008	≤3%	＞1.66
８	0.35	±0.008	≤3%	＞1.66
９	0.30	±0.005	≤3%	＞1.66
10	0.20	±0.005	≤3%	＞1.66
11	0.10	±0.005	≤3%	＞1.66

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