High volume fraction SiCp/Al composite is a perfect electronic packaging materials because of its excellent thermal-physical properties, lower density and adjustable CTE.
Thermal-physical properties
Properties of SiCp/Al composites
Thermal conductivity （w/mk）
170~200
Density（g/cm3）
2.8~3.1
Thermal coefficient of expansion（×10-6K-1）
6.9~9.7
Bending strength（MPa）
300~400
tensile strength （MPa）
≥200
Modulus（GPa）
≥200
gas tightness
≤1×10-3Pacm3/s
Specifications
The main products including: raw material or parts of SiCp/Al serials, Cu/Diamond serials, used for electronic packing baseplate, heat sink and so on. The thermal conductivity and thermal coefficient of expansion can be adjusted according to difference demand.
