Home | About | News | Products | Technology R & D | Quality | Contact us | 中文
 
Tin Lead Solder
 
  No-Clean Solder Wire
During the processing of our‘No-Clean Solder Wire’, strict quality control management and the advanced drawing process are implemented. Meanwhile, the ratio of both trace metals and impurity substances in the wires are precisely controlled and the welding flux in the wires is distributed uniformly to insure welding continuity. Besides a clean and tidy packing as well as a bright and smooth surface, our wires, in welding process, also provide excellent wettability and weldability, keeping the process in a friendly environment of few smell, few smoke, few flitting, and non-toxic environment.

Diameter        0.3mm        0.5mm        0.6mm        0.8mm        1.0mm
    Tolerance       ±0.02       ±0.02       ±0.03       ±0.03       ±0.04
    Net Weight      0.5kg、1.0kg
    All kinds of wires(e.g. tin-lead, lead-free, flux core, solid core)

Sn42Bi58

Sn96.5Ag3.0Cu0.5

Sn99Ag0.3Cu0.7

Sn62Pb36Ag2

Sn63Pb37

Sn60Pb40

 

  Low Melting Point Solder wire

The Low-melting solder wire, provided with a lower melting point and easy to operate, is one of the most environment friendly and energy saving solders for welding. It is commonly used in electronic components’ gradient welding as well as the welding of thermolabile parts such as LED, LCD, LNB, radiators, thermosensors, fire alarms, flexible plates, air-condition protectors and the parts for lightningproof and temperature control. In the solder wire, one of Compo’s unique technic known as the Metal Crystal Refinement Technology is adopted to toughen the SnBi58 wire, eliminating its brittleness, thus providing the wire with a fine, clean and bright surface.

Diameter        0.3mm        0.5mm        0.8mm        1.0mm        1.5mm
    Tolerance       ±0.02       ±0.02       ±0.03       ±0.04       ±0.04
    Net Weight      50g、100g、200g、500g
    For the pre-order wires further consultant is necessary.

 

Description of SnBi58 Lead-free Solid Solder Wire

1.Application

Applied in the field of low temperature electronics surface mounting technology, Such as Lead-free hand soldering, PCB secondary soldering. Application to thermal cut-off、thermal protector、Capacitors heating fuse, etc.

2.Performance

Nontoxic and environment friendly、Low melting point and stability;tidiness surface and not easy to tie;non-flux pollution,no dross residual.

Tab.1 Component control of Sn-Bi58 tin wire

Element

Sn

Pb

Ag

Fe

Bi

Al

Cd

Ni

Sb

Zn

Cu

As

Hg

Guide Line(wt%)

41.5~42.5

0.05 Max.

0.05 Max.

0.020Max.

Rem.

0.001Max.

0.002 Max.

0.01 Max.

0.05 Max.

0.001 Max.

0.05 Max.

0.03 Max.

0.002 Max.

Tab.2 Physical property of Sn-Bi58

Melting point ℃

Gravity g/cm3

Resistivity μΩ·cm

85℃thermal conductivity J/m·s·K

20℃coefficient of heat expand 10-6/K

Modulus of elasticity GPa

Brinell hardness HB

0.2% yield strength MPa

Tensile strength MPa

Elongation %

Shear strength MPa (1mm/min)

Ambient temperature

100℃

139

8.75

33

21

15

11.9

22

49.1

60.4

46

48.0

15.6

Remarks

Below 125℃ not creeping

3.Specification

Standard DIA: Φ6.0、Φ2.0、Φ1.0、Φ0.8、Φ0.5、Φ0.3,Or Customized according to request.

DIA < Φ2.0, Package with reel: 200g/Reel、500g/Reel、1kg/Reel,16kg/Box,

DIA > Φ2.0, Packaging by negotiation.

4.Attentions

Handle with care、Keep from heat、No acid

 

 

Copyright@ Beijing Compo Advanced Technology Co.,Ltd. Tel:010-82241219 82241218 Fax:010-62366747
ADD:North Third Ring Road, Haidian District, Beijing, No. 43 Zip:100088
E-mail:composolder@163.com market@composolder.com 京ICP备06003955号