Beijing Compo In The Shanghai NEPCON Show

As one of the leading companies in SMT solder, Beijing Compo Advanced Technology Co., Ltd. took part in Shanghai NEPCON Show from April 20th to 22nd.

Compo’s new industrial park completed recently will provide the company a capacity of 5000 tons of solders for electronic assembly industry every year, and the company develops a series of novel products, for example, the ultra fine solder powders (specified in 5# and 6#) with low oxide content, to meet the demand of semiconductor and dispensed solder paste markets. Additionally, Compo’s SnBi58 wires (from Φ0.1mm~Φ1.2mm) and the anti-oxidation alloys (SnP5 and SnP1 etc.) present excellent qualities, which enables Compo a sophisticated company in metal materials and technologies.

During the show, some of the customers agreed on several projects with Compo, and further cooperation from both local and oversea clients will be taken into account.