In view of the development trend of lead-free and highly reliable solders, especially the reliability of automotive electronics and 5G, Compo developed LF516SR series of lead-free solder powders. Based on the characteristics of Sn-Ag-Cu alloy, LF516SR adjusted the composition of the alloy and microalloy, and improved the micro-structure and properties, so that it can provide customers with highly reliable interconnection solutions.

Applications 

Vehicle electronics

5G communication electrons

Power module

Key features

Excellent wettability

Excellent thermal cycling reliability

Excellent high and low temperature impact resistance

Excellent resistance of crack propagation

Excellent electromigration and interfacial microstructure stability

Specification