Compo solders are widely used in integrated circuit packaging, precision packaging, semiconductor packaging, low temperature soldering, and products with higher reliability requirement.

BGA Ball

Compo supplies BGA Solder Balls of different specifications for IC packaging and semiconductor packaging.

Standard Products

Alloy series：Sn96.5/Ag3.0/Cu0.5、Sn63/37

Sphere Diameter（mm）：φ0.2、φ0.25、φ0.3、φ0.35、φ0.4、φ0.45、φ0.5、 φ0.55、φ0.6、φ0.65、φ0.76

Customized Products

Alloy series:

High temperature: Sn-Sb, 582N

Middle temperature:Sn-Ag-Cu, Sn-Ag-Cu-Ni, Sn-Ag, Sn-Cu

Low temperature:Sn-Bi,  COMPO LF143®

Sphere Diameter（mm）:0.2-1.20

50μm and 100μm are also available.

CCGA Column

Compo supplies CCGA columns of different specifications, used for CCGA components production.

CCGA column can realize high-density 3D packaging; and it has high heat resistance and high tensile strength. Comparing to BGA, it has higher I/O packaging density than BGA, better anti fatigue service life, and good heat dissipation performance, so that it provides better solution to the problem of CTE mismatch during packaging, and can adapt to the harsh service environment.

Key features

Can achieve high density 3D packaging.

High heat resistance; high tensile strength. 

Has higher I/O packaging density than BGA, better fatigue resistance, and good heat dissipation, thus provide better solution to the mismatch of CTE, and adapt to the harsh use environment.

Types

tin column;

enhanced tin column,;

micro-coil;

Specifications

Please contact us for customization.

Tin wires

Flux-cored tin wires, suitable for precision soldering, automatic soldering, etc.

Types

 0.1, 0.2, 0.3, etc.

Bi-based low temperature wires, winding neatly without knot;no flux contamination, controllable residue, suitable for soldering parts which are not resistant to high temperature.

Types

6.0、2.0、1.0、0.8、0.5、0.3、0.2

 

 

Note: Please contact us for more information.